Manuscript Submission

Submission Policy
Presenters who DO NOT complete the registration or FAIL TO show up for the presentation without notifying the program chairs of cancellation will not be permitted to submit the journal.

Submit to Journal
All full manuscript submissions must be received via the Elsevier Editorial System (EES) electronic submission site. Every manuscript submission is assigned to submit to either Thin Solid Films or Surface Coatings and Technology, as follows:
For presenters in Symposium A, B, and C, please submit your manuscripts to Thin Solid Films
For presenters in Symposium D, E, and F, please submit your manuscripts to Surface Coatings and Technology

Submission deadline for full manuscripts to be assured for consideration for publication is October 18, 2013. No exception.

Cover Letter
IMPORTANT: You need to submit the Cover Letter along with your manuscript, and this Cover Letter must include the following information.
Accepted abstract number: (for example, A-O-116001)
Registration number: (for example, 10060001)

Both “Accepted abstract number” and “Registration number” are required in your Cover Letter. Without this information, the manuscript will be straight rejected without consideration nor reviewing.

How to prepare your manuscript?
Please prepare your manuscript according to the authors’ guideline of Thin Solid Films and Surface Coatings and Technology.
Thin Solid Films - http://www.elsevier.com/journals/thin-solid-films/0040-6090/guide-for-authors 
Surface Coatings and Technology - http://www.elsevier.com/journals/surface-and-coatings-technology/0257-8972/guide-for-authors 
There is no length restriction for the submission.